| BCP Chemical Facility |
Niowave houses a chemistry lab to conduct buffered
chemical polish (BCP) etching using hydrofluoric
acid, nitric acid, and phosphoric acid (1:1:2 ratio).
We have capabilities of etching both niobium (Nb)
and copper (Cu). Chemical machining is also
practiced when tolerances are critical.
chemical polish (BCP) etching using hydrofluoric
acid, nitric acid, and phosphoric acid (1:1:2 ratio).
We have capabilities of etching both niobium (Nb)
and copper (Cu). Chemical machining is also
practiced when tolerances are critical.
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| Niowave, Inc. 1012 N Walnut St. Lansing, MI 48906 Tel. (517)999-3475 Fax (517)999-3626 info@niowaveinc.com |